As part of Intel's Integrated Device Manufacturer 2.0 (IDM2.0) strategy, FSM is rapidly expanding its operation to deliver output for both internal and foundry customers with state-of-the-art technologies arriving in high-volume manufacturing at a 2-year cadence going forward. […]
Selected candidates will work with other members in Global Yield org including Process Integration, Device and Defect engineering teams, fab module/yield teams and Technology Development (TD) team members to achieve yield ramp-up and process optimization in early production stage, supporting internal and external customers...